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What is a fully automatic magnetron sputtering station?

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What is a fully automatic magnetron sputtering station?

Release date:2018-01-04 Author: Click:

What is a fully automatic magnetron sputtering station?

Magnetron sputtering is for high-speed sputtering at low atmospheric pressure. It is necessary to effectively improve the gas ionization rate. By introducing magnetic field on the surface of target cathode and using magnetic field to restrain charged particles to improve the density of ion body to increase sputtering rate, automatic magnetron sputtering platform, through vacuum system, downstream pressure closed-loop control, radio frequency power supply, gas flow and automatic control of process, as well as security interlocking, intelligent monitoring, online state memory, power-off protection and so on. Domestic manufacturers can do all these functions.

Technical classification

It can be divided into DC magnetron sputtering method and RF magnetron sputtering method.

Feature introduction

The automatic magnetron sputtering table is controlled by PLC and operated by touch screen. Its digital parameter interface and automatic operation mode provide excellent research and development and production platform for users.

Main uses

The automatic magnetron sputtering platform can be used to deposit AI, Au, Cr, Ti, Ni, Cu, W, SiO 2, various metals, non-metals, single layer and multi-layer films on the surface of silicon, plastics, ceramics, glass, quartz, III-V compounds and metals. It has the characteristics of good uniformity, high sputtering rate, low substrate temperature rise and target saving.

Scope of use

This equipment is mainly used in the development and manufacture of devices in the fields of microelectronics, optoelectronics, communications, micromachineries and so on.


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